Bump Deposition Process for Hllhc Atlas Upgrade Si...

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Country: Japan
Summary: Bump Deposition Process for Hllhc Atlas Upgrade Silicon Pixel Detector Frontend Asic Wafers 1 Set
JPT Ref No: 116778032
Deadline: 28 Apr 2025
Competition: ICB
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.:
Purchaser's Detail :

Purchaser : INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION
Kuroi Munenori, Contracts Unit 1, Contracts Division, Financial Department, Inter-University Research Institute Corporation High Energy Accelerator Research Organization, 1-1 Oho Tsukuba-Shi 305-0801 Japan, Tel 029-864-5164

Description :
Bump deposition process for HLLHC ATLAS upgrade silicon pixel detector frontend ASIC wafers 1 set
Documents :

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Bump Deposition Process for Hllhc Atlas Upgrade Silicon Pixel Detector Frontend Asic Wafers 1 Set